Atomic Layer Deposition for Emerging Thin-film Materials and Applications

Date: April 23, 2020

Time: 08:30PM - 10:00PM

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This webinar was presented in conjunction with the Journal of Materials Research Focus Issue on Atomic Layer Deposition for Emerging Thin-film Materials and Applications. The webinar featured three presentations from authors from the Focus Issue, and each talk was followed by an interactive Q&A session with those authors.

Atomic layer deposition (ALD) is a powerful and elegant technique for depositing atomically controllable thin film materials. ALD proceeds with a unique growth mechanism relying on alternately sequential surface-controlled self-saturation reactions, which enables the atomic-scale layer-by-layer deposition of the uniformly conformal films over virtually any topologies.

Since the 2000s, ALD has greatly widened its variety of applications from semiconductors to catalysis, biomedicine, gas sensing, anti-corrosion coating, clean-energy technologies (batteries, fuel cells, supercapacitors, solar cells, etc.), and nano- and micro-electromechanical systems (N/MEMS). The characteristic merits of ALD include not only its superior controllability over film thickness, composition, and crystallinity, but also its unique capability for constructing conformal thin-film coatings on complex structures. These merits underlie the fast expansion of ALD into new areas over the past decades, such as metal-organic frameworks, two-dimensional layered materials, single-atom catalysis, solid-state batteries, and so forth.

Talk Presentations:

  • Encapsulation of Organic and Nanocrystal LEDs via Atomic Layer Deposition
    Rong Chen, Huazhong University of Science and Technology
  • Atomic layer–deposited nanostructures and their applications in energy storage and sensing
    Yongfeng Mei, Fudan University
  • Nanoscale Al2O3 coating to stabilize selenium cathode for sodium–selenium batteries
    Jian Liu, University of British Columbia
Speaker(s):
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This webinar is presented in conjunction with the Journal of Materials Research Focus Issue on Atomic Layer Deposition for Emerging Thin-film Materials and Applications. The webinar will deature three presentations from authors from the Focus Issue, and each talk will be followed by an interactive Q&A session with those authors.

Atomic layer deposition (ALD) is a powerful and elegant technique for depositing atomically controllable thin film materials. ALD proceeds with a unique growth mechanism relying on alternately sequential surface-controlled self-saturation reactions, which enables the atomic-scale layer-by-layer deposition of the uniformly conformal films over virtually any topologies. 

Since the 2000s, ALD has greatly widened its variety of applications from semiconductors to catalysis, biomedicine, gas sensing, anti-corrosion coating, clean-energy technologies (batteries, fuel cells, supercapacitors, solar cells, etc.), and nano- and micro-electromechanical systems (N/MEMS). The characteristic merits of ALD include not only its superior controllability over film thickness, composition, and crystallinity, but also its unique capability for constructing conformal thin-film coatings on complex structures. These merits underlie the fast expansion of ALD into new areas over the past decades, such as metal-organic frameworks, two-dimensional layered materials, single-atom catalysis, solid-state batteries, and so forth.

Talk Presentations:

  • Encapsulation of Organic and Nanocrystal LEDs via Atomic Layer Deposition
    Rong Chen, Huazhong University of Science and Technology
  • Atomic layer–deposited nanostructures and their applications in energy storage and sensing
    Yongfeng Mei, Fudan University
  • Nanoscale Al2O3 coating to stabilize selenium cathode for sodium–selenium batteries
    Jian Liu, University of British Columbia