Atomic layer deposition (ALD) is a powerful and elegant technique for depositing atomically controllable thin film materials. ALD proceeds with a unique growth mechanism relying on alternately sequential surface-controlled self-saturation reactions, which enables the atomic-scale layer-by-layer deposition of the uniformly conformal films over virtually any topologies.
Since the 2000s, ALD has greatly widened its variety of applications from semiconductors to catalysis, biomedicine, gas sensing, anti-corrosion coating, clean-energy technologies (batteries, fuel cells, supercapacitors, solar cells, etc.), and nano- and micro-electromechanical systems (N/MEMS). The characteristic merits of ALD include not only its superior controllability over film thickness, composition, and crystallinity, but also its unique capability for constructing conformal thin-film coatings on complex structures. These merits underlie the fast expansion of ALD into new areas over the past decades, such as metal-organic frameworks, two-dimensional layered materials, single-atom catalysis, solid-state batteries, and so forth.
Encapsulation of Organic and Nanocrystal LEDs via Atomic Layer Deposition
Rong Chen, Huazhong University of Science and Technology
Atomic layer–deposited nanostructures and their applications in energy storage and sensing
Yongfeng Mei, Fudan University
Nanoscale Al2O3 coating to stabilize selenium cathode for sodium–selenium batteries
Jian Liu, University of British Columbia