Dr. John D. Williams is the lead engineer for fabrication and prototyping in the Advanced Electromechanical Technologies (AET) team at Boeing Research and Technology (BR&T) in Huntsville, AL. John has also served as the lead for the Surface Metal Micromachining at Sandia National Laboratories in Albuquerque, NM, and as Assistant Professor of Electrical, Materials, and Optical Engineering at the University of Alabama in Huntsville. Dr. Williams has 14 years of experience in microelectromechanical systems (MEMS) with over 35 peer reviewed publications and 11 issued patents in the areas of materials processing, metals, microfabrication, photonics, RF electronics, and bioMEMS. His research has been funded by NSF, DARPA, NASA, NIH, and US ARMY-SMDC. Dr. Williams is currently the principal investigator on three NextFlex projects for technology maturation of flexible hybrid electronics and a co-principal investigator on a NASA Advanced Air Transport Technology (AATT1) project. He serves as the Boeing representative on the NextFlex Technical Council and Co-Leads the NextFlex Materials Working Group.